Ntshiab Tantalum CapillaryTube

Nyob rau hauv niaj hnub chromatography (HPLC), siab -kawg biomedical implants (xws li marker rings, vascular stents), semiconductor ultra-ntshiab microfluidic chips, thiab siab - kub sensors, txoj kab uas hla ntawm cov kua channel feem ntau miniaturized mus rau millimeter los yog txawm micron theem. Nyob rau hauv xws li ib tug me me qhov chaw, cov kua tso rau pem hauv ntej tsis tshua muaj kev xav tau ntawm cov khoom corrosion, microflow kuj, hlau ion nag lossis daus (Leaching) thiab siab txwv.

Raws li pom los ntawm kev siv rau daim duab, peb lub siab -kev ua tau zoo seamless ntshiab tantalum capillary raj (High-Precision Seamless Tantalum Capillary Tubes) nruj me ntsis siv 100% siab-purity R05200 ntshiab tantalum (purity ntau dua los yog sib npaug rau 99. 95%) uas muaj ntau lub sij hawm electron raws li cov khoom siv hauv paus. Tom qab multi- dhau Cold Drawing (Cold Drawing) thiab precision micro- phab ntsa txo molding, ua ke nrog ntau-theem siab nqus tsev vacuum annealing nyob rau hauv nruab nrab, cov khoom tsis tsuas yog precisely tswj qhov loj kam rau ua ntawm micron theem, tab sis kuj ua tiav ultra- siab flatness thiab crack {{1} micron{1}. Qhov no series ntawm capillaries yog heev biocompatible rau tib neeg lub cev thiab muaj peev xwm tiv taus acids muaj zog rau lub neej. Nws yog ib qho tseem ceeb ntawm lub cev channel rau kev txiav - cov kua dej thiab cov tshuab electrode.

I. Cov txiaj ntsig zoo heev (Cov Neeg Tseem Ceeb Engineering Advantages)

Ultra- qhov siab qhov tseeb thiab cov phab ntsa tuab tuab (Micron-Level Tolerances): Raws li pom hauv daim duab, lub taub sab hauv (ID) thiab sab nraud (OD) kam rau ua ntawm peb cov tantalum capillary raj tuaj yeem tswj tau qhov tseeb hauv ± 0.01 hli lossis ± 0.005 hli. Cov phab ntsa tsis tshua muaj siab ua kom ntseeg tau tias cov yeeb nkab yuav tsis ua rau thermal deformation lossis kev ntxhov siab rupture vim cov phab ntsa hauv zos thinness thaum nws dhau los ntawm kev kub siab thiab siab txaus corrosive xov xwm.

Nano-theem flatness thiab super- tsis muaj dej tsis kam (Super-Smooth Inner Surface): Nrog tshwj xeeb kos duab tuag thiab super-lubricating molding tshuab, tantalum yeeb nkab yog du zoo li daim iav, tsis muaj txhua yam khawb, wrinkles lossis stretch marks. Qhov no tsis yog tsuas yog ua kom muaj kev kub ntxhov thiab ntws tawm hauv cov kua dej microchannel, tab sis kuj tseem tiv thaiv lub cev adsorption residue ntawm cov kab mob chemical los yog cov proteins hauv cov qauv, thiab tiv thaiv kev sib kis ntawm - kis kab mob ntawm kev kuaj pom.

Zoo heev molding plasticity thiab Burr-Dawb flush kawg lub ntsej muag (Burr-Dawb & Formable Ends): Peb cov hlab capillary yog nyob rau hauv ib tug tag nrho annealed mos lub xeev (Annealed State), nrog ib tug elongation tus nqi txog li 25%, uas yuav siv tau los ntawm cov neeg muas zaub rau tom qab bending, flaring, shrinking heev {3} sib koom ua ke nrog me me. Lub ntsej muag kawg ntawm tag nrho cov yeeb nkab fittings Hoobkas tau ua tiav los ntawm kev sib tsoo thiab ultrasonic deburring, thiab qhov incision yog tiaj, uas zoo kawg nkaus phim cov tsis yog -kev puas tsuaj los ntawm kev kho mob thiab precision instruments.

II. Core technical parameters thiab tshuaj muaj pes tsawg leeg matrix (Technical Parameter & Chemistry Matrix)

Txhawm rau ua kom tau raws li cov txheej txheem siab traceability ntawm peb cov neeg siv khoom, cov txheej txheem tseem ceeb tau txheeb xyuas raws li hauv qab no:

Technical Parameter & Chemistry Matrix

Qhov ntev	Technical Specifications & Matrix
Cov ntaub ntawv yooj yim
Khoom Qib	R05200 (unalloyed siab-purity ntshiab tantalum)\|Optional R05400 (electron beam remelting ultra-tsis tshua muaj siab ntshiab tantalum qib)
Cov qauv	ASTM B521 (Standard Specification rau Seamless thiab Welded Tantalum thiab Tantalum Alloy Pipes)
Kev Pabcuam	High Vacuum Completely Annealed Soft State (Nqus Annealed)
Nto tiav	Bright Polished & Pickled) los xyuas kom meej tias tsis muaj residue thiab tsis muaj microscopic tawg nyob rau hauv daim iav ntawm sab hauv thiab sab nrauv phab ntsa
Specifications	Muaj peev xwm ua tau raws li qhov tshwj xeeb siab - daim ntawv thov precision (Txhawb kev hloov kho rau micro-fluidic designs)
OD Ntau	Φ 0.2 hli - φ 5.0mm
Phab ntsa Thickness	Yuav ua tau rau txoj kab uas hla φ 10mm-φ 500 mm (zoo heev phab ntsa thickness kam rau ua ± 0.05 hli tseem tuaj yeem khaws cia hauv qhov loj deformation)
Ua siab ntev	OD / ID: ± 0.01 hli (txog ± 0.005 hli); Phab ntsa thickness: ± 10%
Neeg kho tshuab	Standard Indicators tom qab Stress Relief Annealing ntawm cov kav dej ntawm chav tsev kub 20℃(Siv Microchannel High Pressure Resistance thiab Bending Rigidity)
Tensile zog	Ntau dua lossis sib npaug li 205 MPa (nrog rau tus kheej zoo heev -txhawb thiab deformation- tiv taus nruj ntawm cov khoom me me)
Yield zog	Ntau dua lossis sib npaug li 140 MPa
Elongation	Ntau dua lossis sib npaug li 25% (kom paub meej tias cov kav dej ultra- nyias nyias yuav tsis tawg hauv phab ntsa thaum lawv raug khoov los yog voj voog)
Chemistry %	Purity Ntau dua lossis sib npaug rau 99.95%, kev tswj nruj ntawm cov ntsiab lus tseem ceeb embrittlement gas thiab sensitizing hnyav hlau
Tau (Matrix Purity)	Ntau dua lossis sib npaug rau 99. 95% (muab bio zoo heev-kev sib raug zoo thiab tshuaj tua kab mob substrate)
Nb (niobium impurity tswj)	Tsawg dua lossis sib npaug li 0.05% (tswj kom tsawg kawg nkaus los tiv thaiv electrochemical heterogeneity)
Fe｜Ni｜Cr	Fe Tsawg dua lossis sib npaug 0.005% ｜Ni Tsawg dua lossis sib npaug 0.002%｜Cr Tsawg dua lossis sib npaug 0.002%
O｜N｜H	O Tsawg dua lossis sib npaug rau 0.015% ｜N Tsawg dua lossis sib npaug rau 0.01% ｜H Tsawg dua lossis sib npaug li 0.0015% (hauv 15 ppm los tiv thaiv hydrogen embrittlement)

III. Lean txias txias txheej txheem thiab nto ultra-kev tswj kom huv (Ua haujlwm tsim khoom)

Seamless Piercing & Multi-Pass Drawing: Siv R05200 siab-purity seamless tantalum raj dawb paug raws li qhov pib, nws tau ua tiav los ntawm ntau-theem precision txias kos duab nrog ntau tshaj 20 kis thiab micro-deformation. Grain state tracking yog ua tom qab txhua daim duab hla los xyuas kom meej tias tsis muaj micro-tensile delamination tshwm sim.

Siab -Nqus Interstage Annealing: Ua ntej txhua daim duab mus txog qhov tseem ceeb ntawm kev ua haujlwm txias txias, cov khoom tiav ib nrab yog xa mus rau qhov siab - nqus tsev vacuum annealing rauv, thiab lub tshuab nqus tsev kawm ntawv siab dua 10^-3Pa. Uniform annealing nyob rau hauv lub cub tawg kub, re-refining cov nplej thiab tso lattice distortion kom tswj tau lub zoo meej elongation yuav tsum tau rau tom ntej zoo daim duab.

High-precision puab qhov polishing thiab pickling activation (Inner Surface CMP/Passivation): Multistage micro- polishing thiab pickling ntawm capillary raj yog ua los ntawm kev siv tshwj xeeb ultra- nplua siab- cov kua dej abrasives los yog tov kua qaub tov (HF-). A thin layer of dense and extremely uniform tantalum pentoxide (Ta2O5) inert protective film is produced by chemical peeling off the uneven residue of the surface layer.

CNC tsis yog-kev puas tsuaj ruaj khov-ntev txiav thiab yaug lub ntsej muag (Precision Cutting & Deburring): Qhia qhov tseeb CNC dej dav hlau txiav los yog kev ntxhov siab-dawb micro- txiav, notch yog flush thiab tib lub roundness yog zoo. Nws dhau los ua tus tswv ultrasonic sib sib zog nqus degreasing thiab ziab, thiab ua qhov siab -fold microscopic kuaj (100% tuag-angle-dawb kawg lub ntsej muag thiab sab hauv lub qhov flash tshuaj xyuas) nyob rau hauv 100-theem Clean Bench (Lub Rooj Zaum Huv Huv).

IV. Hla-txiav ciam teb- daim ntawv thov ntug (High- Daim Ntawv Thov Kev Lag Luam Tus Nqi)

Bio-Kev kho mob thiab cov cuab yeej siv kho mob (Cov Khoom Siv Kho Mob & Kev Tso Cai): raws li cov sheaths sab nraud lossis cov kab hluav taws xob hauv lub plawv pacemakers, micro- cov twj tso kua mis, thiab cov hlab ntsha electrodes; Nyob rau hauv X-ray fluoroscopy, lub siab ceev ntawm cov ntshiab tantalum ua rau nws yog ib qho zoo heev txhim kho / marker band.

High-Performance Liquid Chromatography (HPLC): Dav siv dav hauv siab - cov kav dej siab qhia cov raj, sampling koob, thiab kab txuas kab hauv siab -kev ua haujlwm ua kua chromatographs, roj chromatographs, thiab huab hwm coj spectrometers (LC-MS). Nws muaj zog corrosion tsis kam rau cov kua qaub / alkalis kom tshem tawm cov kev cuam tshuam ntawm cov hlau ion muaj kuab paug rau ntawm qhov kev tshawb pom hauv paus.

Semiconductor thiab chemical microfluidics (Semiconductor Microfluidics): raws li qhov tseeb micro- faib cov channel rau siab - kawg ntub etching thiab siab - corrosive reagents (xws li muaj zog concentration dej huab tais thiab hydrochloric acid) hauv cov txheej txheem etching.