Tantalum Spun Funnels

Hauv kev txiav-ntev txheej txheem xws li semiconductor vapor theem Epitaxy (Epitaxy), siab -kub Ion Implantation (Ion Implantation), thiab ultra-kev tswj lub tshuab nqus tsev siab, qhov sib xws ntawm cov pa roj ntws tawm thiab kev cuam tshuam ntawm thermal tawg yog qhov tseem ceeb. Nyob rau hauv lub ntsej muag ntawm no hom tapered Conical los yog ob chav funnel qauv, tsis tsuas yog cov khoom poob yog zoo, tab sis kuj lub weld seam nyob rau hauv lub internal ntws channel yog heev yooj yim mus thab Laminar Flow (Laminar Flow), thiab ua rau lub zos thermal stress concentration.

Xyoo 2026, peb yuav tso tawm ib tiam tshiab ntawm Kev Cai Precision Spun Tantalum Cheebtsam. Cov khoom siv 99.95% hluav taws xob- qib siab- purity tantalum phaj ua cov khoom siv hauv paus, thiab tsim nyob rau hauv ib qho kev nres los ntawm cov txheej txheem CNC Power Spinning, uas zoo kawg nkaus siv rau hauv tus account qhov sib xws ntawm gradient nkhaus thiab cov phab ntsa siab heev.

I. Core Technology Advantages (Elite Engineering Advantages)

Seamless Streaming Profiles thiab Zero Friction (Seamless Streaming Profiles Piv txwv li, concave arc nto ntawm daim iav (zoo reflectivity) tuaj yeem muab kev ua haujlwm zoo aerodynamic thiab tsis tshua muaj qhov sib xyaw ua ke thaum siv los ua cov pa roj lossis cov tshuaj tiv thaiv thermal.

Isotropic Grain Structure & Thermal Shock Resistance: Tantalum yog nquag ua hauj lwm hardening thaum txias spinning. Los ntawm kev hloov thev naus laus zis ntawm "ntau- dhau lub teeb yuag deformation thiab nruab nrab ultra- lub tshuab nqus tsev siab annealing (UHV Annealing)", peb tshem tawm cov seem deformation shear stress, kom cov molded seem muaj qhov zoo heev toughness, thiab yuav tsis creep cracking los yog warping nyob rau hauv thermal shock saum 1500 degree.

High-precision los ua ke vuam (CNC Spot Vuam): Raws li qhia hauv daim duab, qhov spinning yog precisely assembled thiab welded nrog plaub- puab tsaig lub nplhaib txhawb nqa ncej. Peb txais yuav qhov tshwj xeeb qhov chaw vuam tshuab nrog micro- cheeb tsam lub zog tswj kom ua tiav fusion thaum compressing qhov vuam kub cuam tshuam cheeb tsam (HAZ) mus rau qib micron, tshem tawm tag nrho recrystallization thiab embrittlement los ntawm cov cua sov hauv zos.

III. Kev tswj cov tshuaj muaj pes tsawg leeg nruj (Chemical Profile Nyhav%)

Txhawm rau tiv thaiv cov qoob loo ntawm cov kab nrib pleb tawg tshwm sim los ntawm microscopic impurities thaum lub sij hawm spinning deformation, peb tau siv cov kev txwv nyuaj rau cov ntsiab lus gaseous uas ua lub luag haujlwm tseem ceeb hauv lub zog tensile:

Ta (qhov tseem ceeb purity): Ntau dua lossis sib npaug rau 99. 95%

O (oxygen): Tsawg dua lossis sib npaug rau 0. 015% N (nitrogen): Tsawg dua lossis sib npaug rau 0. 010% H (hydrogen): Tsawg dua lossis sib npaug rau 0. 0015%

C (carbon): Tsawg dua lossis sib npaug rau 0. 010% Fe (hlau): Tsawg dua lossis sib npaug rau 0. 010% Nb (niobium impurity): Tsawg dua lossis sib npaug rau 0. 050%

IV. Advanced Processing Flow

Wafer blanking thiab microscopic flaw detection: CNC wafer txiav yog nqa tawm nrog ASTM B708 ​​siab- daim ntawv purity, thiab 100% nto eddy tam sim no nrhiav tau los xyuas kom meej tias tsis muaj macroscopic delamination delamination.

Ntau- dhau qhov txias spinning (Hlau spinning): Ntawm lub tshuab CNC spinning tshwj xeeb, hnav tshwj xeeb-cov rotor resistant alloy yog siv los ntes nrog cov xovxwm txheej los ntawm txheej los kho tus nqi deformation.

Lub tshuab nqus tsev siab supercrystalline annealing: annealing ntawm lub tshuab nqus tsev ntawm 10-4Pa ntawm kwv yees li 1100℃kom rov equiaxed cov nplej thiab tshem tawm cov tawv tawv, ua raws li kev sib tw subfine tom ntej.

Kev sib xyaw ntawm cov khoom siv sab hauv thiab micro-beam qhov chaw vuam: laser precision machining ntawm sab hauv cov hniav nyiaj hniav kub los yog lub nplhaib qhov chaw, hauv -situ fixture fastening thiab qis- cua sov input vuam.

Tshuaj polishing thiab ultrasonic ultra- huv huv ntim (semiconductor qib tus qauv).

V. Hla-txiav ciam teb- daim ntawv thov ntug (High-Cov ntawv thov muaj nqis)

Epitaxy Gas Inlets (Epitaxy Gas Inlets): Nyob rau hauv MOCVD los yog siab -kub CVD kab noj hniav, nws ua raws li ib tug spray collector, coj lub khob hliav qab los yog venturi caj pas rau siab -kub corrosive gases.

Beam Line Cheebtsam (Beam Line Components): Nyob rau hauv siab -zog semiconductor ion implanters, lawv ua hauj lwm raws li siab -kub hluav taws xob tiv thaiv cones los thaiv siab - zog electron/ion beam bombardment.

Radiation Shields rau siab- nqus tsev siab- qhov kub ntawm qhov cub: qhov tseem ceeb soj ntsuam qhov kub rwb thaiv tsev lub tes tsho los yog lub tshuab nqus tsev cov cua kub dhau los thaiv cov khoom siv rau ultra- siab- lub tshuab nqus tsev vacuum nyob rau hauv lub chaw soj nstuam.